A technology for forming submicron particle layers on substrates by aerosol flow systems.エアロゾル流システムで基板上にサブミクロン粒子層を形成する技術

閉鎖空間における沈着を考慮したエアロゾルフローシステムを構築した。沈着効率が悪い従来法に代わって本手法を気液界面細胞曝露に応用できれば有用である。An aerosol flow system has been constructed to mimic the delivery of particles to the air-liquid interface. Potentially be applied for the deposition and analysis of submicron particles on various types of substrate without the need for vacuum imaging analysis..

Aerosols deposit behind the sheet (Plant leaf model)?(植物葉モデル)薄板の裏側までエアロゾルが沈着する?

Simultaneous deposition of submicron aerosols onto both surfaces of a plate substrate by electrostatic forces We demonstrate one-step deposition of submicrometer-sized particles suspended in the gas-phase onto a plate type substrate using an electrostatic-assisted spray system. The particles were deposited on plate-type metallic surfaces, on both front and rear sides of the substrate. This “both-side”…

Doctoral presentation (2014/5), 博士公聴会 Immobilization of particles from gas phase onto surfaces 気相からの粒子の基板への固定化

Immobilization of submicron- and nano-particles from gas phase onto solid surfaces by external forces (外力を用いたサブミクロン粒子とナノ粒子の気相から固体基板への固定化)(Thesis is written in English) 2014/5/23 Friday, 15:00 ~ 16:30, BASE1階会議室 発表者: 玄 大雄 (GEN, Masao) ** ** After working with WPI-AIMR, Tohoku University as Assistant Professor, he joined City University of Hong Kong Keywords: Deposition/assembly of particles, Particle exposure system for…

Invited presentation. COMSOL (a simulation software) conference. 熱流体シミュレーション(招待)発表

We were invited for a poster talk at 2013 COMSOL Conference 2013 (Tokyo, 7 Dec.) 熱処理シミュレーションによる酸化物粉末のドーピング効率の向上 Optimization of Post-Heat Treatment for Doping of Metal Oxide Particles by P. Widiatmoko, Y. Kondo, H. Matsushima, W. Lenggoro Liquid-to-solid route for preparing a doped metal oxide (powder) shows advantage on the homogeneity of the precursor as well as…

A workstation for numerical simulation, 計算機

A simulation hardware: 計算機WorkstationRAM: 32 GB; HD = 1 TB;CPU : Intel ® Xeon® Processor X5690(3.46 GHz, 6 core) for Simulation software:, 数値シミュレーション(有限要素法、熱流体、など)FEM based multi-physics COMSOL From fluid flow/heat transfer to structural mechanics and electromagnetic analyses.http://www.comsol.com/ 64 bitOS: Windows® 7 Professional(64bit) Service Pack 1CPU : Intel ® Xeon® Processor X5690(3.46GHz/6 core)CPU(2nd): インテル® Xeon® プロセッサー X5690(3.46GHz/6コア)…